Wafer Grinder uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
This report contains market size and forecasts of Wafer Grinder in global, including the following market information:
Global Wafer Grinder Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Wafer Grinder Market Sales, 2017-2022, 2023-2028, (Units)
Global top five Wafer Grinder companies in 2021 (%)
The global Wafer Grinder market was valued at 631.8 million in 2021 and is projected to reach US$ 910.5 million by 2028, at a CAGR of 5.4% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Wafer Edge Grinder Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Wafer Grinder include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, Daitron and WAIDA MFG, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Wafer Grinder manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Grinder Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Wafer Grinder Market Segment Percentages, by Type, 2021 (%)
Wafer Edge Grinder
Wafer Surface Grinder
Global Wafer Grinder Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Wafer Grinder Market Segment Percentages, by Application, 2021 (%)
Silicon Wafer
SiC Wafer
Sapphire Wafer
Global Wafer Grinder Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Wafer Grinder Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Grinder revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Wafer Grinder revenues share in global market, 2021 (%)
Key companies Wafer Grinder sales in global market, 2017-2022 (Estimated), (Units)
Key companies Wafer Grinder sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
Daitron
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam