IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.
This report contains market size and forecasts of IC Packaging in global, including the following market information:
Global IC Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global IC Packaging Market Sales, 2017-2022, 2023-2028, (M Pcs)
Global top five IC Packaging companies in 2021 (%)
The global IC Packaging market was valued at 39060 million in 2021 and is projected to reach US$ 50150 million by 2028, at a CAGR of 3.6% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
DIP Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of IC Packaging include ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, J-devices, UTAC, JECT and ChipMOS, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the IC Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global IC Packaging Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (M Pcs)
Global IC Packaging Market Segment Percentages, by Type, 2021 (%)
DIP
SOP
QFP
QFN
BGA
CSP
LGA
WLP
FC
Others
Global IC Packaging Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (M Pcs)
Global IC Packaging Market Segment Percentages, by Application, 2021 (%)
CIS
MEMS
Others
Global IC Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (M Pcs)
Global IC Packaging Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies IC Packaging revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies IC Packaging revenues share in global market, 2021 (%)
Key companies IC Packaging sales in global market, 2017-2022 (Estimated), (M Pcs)
Key companies IC Packaging sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Unisem
NantongFujitsu Microelectronics
Hana Micron
Signetics
LINGSEN