As the global economy mends, the 2021 growth of Three Dimensional Integrated Circuits (3D ICs) will have significant change from previous year. According to our (LP Information) latest study, the global Three Dimensional Integrated Circuits (3D ICs) market size is USD million in 2022 from USD million in 2021, with a change of % between 2021 and 2022. The global Three Dimensional Integrated Circuits (3D ICs) market size will reach USD million in 2028, growing at a CAGR of % over the analysis period.
The United States Three Dimensional Integrated Circuits (3D ICs) market is expected at value of US$ million in 2021 and grow at approximately % CAGR during review period. China constitutes a % market for the global Three Dimensional Integrated Circuits (3D ICs) market, reaching US$ million by the year 2028. As for the Europe Three Dimensional Integrated Circuits (3D ICs) landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 5-year period.
Global main Three Dimensional Integrated Circuits (3D ICs) players cover TSMC, STMicroelectronics, Intel, and Micron Technology, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Three Dimensional Integrated Circuits (3D ICs) market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
Through-Silicon Via (TSV)
Silicon Interposer
Through-Glass Via
Others
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
Consumer Electronics
Industrial
IT and Telecommunication
Healthcare
Military and Defense
Automotive
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
TSMC
STMicroelectronics
Intel
Micron Technology
Xilinx
STATS ChipPAC
UMC
Tezzaron Semiconductor
SK Hynix
IBM
Samsung
ASE Group
Amkor Technology
Qualcomm
JCET