As the global economy mends, the 2021 growth of Thin Wafers Temporary Bonding Equipment and Materials will have significant change from previous year. According to our (LP Information) latest study, the global Thin Wafers Temporary Bonding Equipment and Materials market size is USD million in 2022 from USD million in 2021, with a change of % between 2021 and 2022. The global Thin Wafers Temporary Bonding Equipment and Materials market size will reach USD million in 2028, growing at a CAGR of % over the analysis period.
The United States Thin Wafers Temporary Bonding Equipment and Materials market is expected at value of US$ million in 2021 and grow at approximately % CAGR during review period. China constitutes a % market for the global Thin Wafers Temporary Bonding Equipment and Materials market, reaching US$ million by the year 2028. As for the Europe Thin Wafers Temporary Bonding Equipment and Materials landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 5-year period.
Global main Thin Wafers Temporary Bonding Equipment and Materials players cover 3M, ABB, Accretech, and AGC, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Thin Wafers Temporary Bonding Equipment and Materials market by product type, application, key players and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022 in Section 2.3; and forecast to 2028 in section 10.7.
Chemical Debonding
Hot Sliding Debonding
Mechanical Debonding
Laser Debonding
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 10.8.
< 100 µm Wafers
below 40µm Wafers
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major players in the market. The key players covered in this report: Breakdown data in in Chapter 3.
3M
ABB
Accretech
AGC
AMD
Cabot
Corning
Crystal Solar
Dalsa
DoubleCheck Semiconductors
1366 Technologies
Ebara
ERS
Hamamatsu
IBM
Intel
LG Innotek
Mitsubishi Electric
Qualcomm
Robert Bosch
Samsung
Sumitomo Chemical