As the global economy mends, the 2021 growth of Electronic Board Level Underfill and Encapsulation Material will have significant change from previous year. According to our (LP Information) latest study, the global Electronic Board Level Underfill and Encapsulation Material market size is USD million in 2022 from USD million in 2021, with a change of % between 2021 and 2022. The global Electronic Board Level Underfill and Encapsulation Material market size will reach USD million in 2028, growing at a CAGR of % over the analysis period.
The United States Electronic Board Level Underfill and Encapsulation Material market is expected at value of US$ million in 2021 and grow at approximately % CAGR during review period. China constitutes a % market for the global Electronic Board Level Underfill and Encapsulation Material market, reaching US$ million by the year 2028. As for the Europe Electronic Board Level Underfill and Encapsulation Material landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 5-year period.
Global main Electronic Board Level Underfill and Encapsulation Material players cover Fuller, Masterbond, Zymet, and Namics, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Electronic Board Level Underfill and Encapsulation Material market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
No Flow Underfill
Capillary Underfill
Molded Underfill
Wafer level Underfill
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
Semiconductor Electronics Device
Aviation & Aerospace
Medical Devices
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
Fuller
Masterbond
Zymet
Namics
Epoxy Technology
Yincae Advanced Materials
Henkel