Fine pitch leadframes allow for smaller packages by reducing the gap between the tips of the inner leads. A leadframe with this ultra-fine pitch brings the lead tips closer together than conventional leadframes, reducing gold wire consumption and improving wafer efficiency by shrinking semiconductor chip size; thereby improving overall price/performance.
This report contains market size and forecasts of Fine Pitch Leadframe in global, including the following market information:
Global Fine Pitch Leadframe Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Fine Pitch Leadframe Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Fine Pitch Leadframe companies in 2021 (%)
The global Fine Pitch Leadframe market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Stamping Process Leadframe Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Fine Pitch Leadframe include Mitsui High-tec, Toppan, Shinko, HAESUNG DS, ASE Electronics, POSSEHL, Dynacraft Industries, DSK Technologies and Batten and Allen, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Fine Pitch Leadframe manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Fine Pitch Leadframe Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Fine Pitch Leadframe Market Segment Percentages, by Type, 2021 (%)
Stamping Process Leadframe
Etching process Leadframe
Global Fine Pitch Leadframe Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Fine Pitch Leadframe Market Segment Percentages, by Application, 2021 (%)
Integrated Circuit
Discrete Device
Others
Global Fine Pitch Leadframe Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Fine Pitch Leadframe Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Fine Pitch Leadframe revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Fine Pitch Leadframe revenues share in global market, 2021 (%)
Key companies Fine Pitch Leadframe sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Fine Pitch Leadframe sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Mitsui High-tec
Toppan
Shinko
HAESUNG DS
ASE Electronics
POSSEHL
Dynacraft Industries
DSK Technologies
Batten and Allen
Unisem Group
Dynacraft Industries
Chang Wah Technology
QPL Limited
Shenzhen Xinhaisen Technology
Phoenix Pioneer Technology