It used to protect electronic devices in the harshest operating conditions protecting from chemicals, dust, heat, water, corrosive atmospheres, physical shock, or just the general environment. The materials are used to either 'encapsulate' individual components, or 'pot' the entire unit.
This report contains market size and forecasts of Electronic Potting and Encapsulation in global, including the following market information:
Global Electronic Potting and Encapsulation Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Electronic Potting and Encapsulation Market Sales, 2017-2022, 2023-2028, (Tons)
Global top five Electronic Potting and Encapsulation companies in 2021 (%)
The global Electronic Potting and Encapsulation market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Silicone Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Electronic Potting and Encapsulation include Henkel, Momentive, Dow Corning, Shin-Etsu Chemical, Element Solutions, H.B. Fuller, Wacker Chemie AG, CHT Group and Nagase, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Electronic Potting and Encapsulation manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Electronic Potting and Encapsulation Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Electronic Potting and Encapsulation Market Segment Percentages, by Type, 2021 (%)
Silicone
Epoxy
Polyurethane
Global Electronic Potting and Encapsulation Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Electronic Potting and Encapsulation Market Segment Percentages, by Application, 2021 (%)
Automotive
Consumer Electronics
Others
Global Electronic Potting and Encapsulation Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Electronic Potting and Encapsulation Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Electronic Potting and Encapsulation revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Electronic Potting and Encapsulation revenues share in global market, 2021 (%)
Key companies Electronic Potting and Encapsulation sales in global market, 2017-2022 (Estimated), (Tons)
Key companies Electronic Potting and Encapsulation sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Henkel
Momentive
Dow Corning
Shin-Etsu Chemical
Element Solutions
H.B. Fuller
Wacker Chemie AG
CHT Group
Nagase
Elkem Silicone
Elantas
Lord
Won Chemical
Namics Corporation
Showa Denka
Panacol