This report contains market size and forecasts of Die Flip Chip Bonder in global, including the following market information:
Global Die Flip Chip Bonder Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Die Flip Chip Bonder Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Die Flip Chip Bonder companies in 2021 (%)
The global Die Flip Chip Bonder market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Fully Automatic Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Die Flip Chip Bonder include Shinkawa, Electron-Mec, ASMPT, SET, Athlete FA and Muehlbauer, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Die Flip Chip Bonder manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Die Flip Chip Bonder Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Die Flip Chip Bonder Market Segment Percentages, by Type, 2021 (%)
Fully Automatic
Semi-Automatic
Global Die Flip Chip Bonder Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Die Flip Chip Bonder Market Segment Percentages, by Application, 2021 (%)
IDMs
OSAT
Global Die Flip Chip Bonder Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Die Flip Chip Bonder Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Die Flip Chip Bonder revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Die Flip Chip Bonder revenues share in global market, 2021 (%)
Key companies Die Flip Chip Bonder sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Die Flip Chip Bonder sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Shinkawa
Electron-Mec
ASMPT
SET
Athlete FA
Muehlbauer