A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking silicon wafers or dies and interconnecting them vertically using.
This report contains market size and forecasts of 3D Chips (3D IC) in global, including the following market information:
Global 3D Chips (3D IC) Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global 3D Chips (3D IC) Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five 3D Chips (3D IC) companies in 2021 (%)
The global 3D Chips (3D IC) market was valued at 8869.1 million in 2021 and is projected to reach US$ 23340 million by 2028, at a CAGR of 14.8% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
3D Wafer-Level Chip-Scale Packaging (WLCSP) Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of 3D Chips (3D IC) include ASE Group, Samsung Electronics Co., Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, Toshiba Corporation, Amkor Technology, United Microelectronics, Stmicroelectronics and Broadcom, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the 3D Chips (3D IC) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global 3D Chips (3D IC) Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global 3D Chips (3D IC) Market Segment Percentages, by Type, 2021 (%)
3D Wafer-Level Chip-Scale Packaging (WLCSP)
3D TSV
Others
Global 3D Chips (3D IC) Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global 3D Chips (3D IC) Market Segment Percentages, by Application, 2021 (%)
Consumer Electronics
Telecommunication
Automotive
Others
Global 3D Chips (3D IC) Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global 3D Chips (3D IC) Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies 3D Chips (3D IC) revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies 3D Chips (3D IC) revenues share in global market, 2021 (%)
Key companies 3D Chips (3D IC) sales in global market, 2017-2022 (Estimated), (K Units)
Key companies 3D Chips (3D IC) sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASE Group
Samsung Electronics Co., Ltd.
STMicroelectronics N.V.
Taiwan Semiconductor Manufacturing Company Limited
Toshiba Corporation
Amkor Technology
United Microelectronics
Stmicroelectronics
Broadcom
Intel
Jiangsu Changjiang Electronics Technology
TSMC
Micron Technology